Bluetooth 5.0, NFC expansion board, STM32Cube low-layer APIs and more – 06 September 2017

Next-generation Bluetooth 5.0 chip boosts connected smart things

The BlueNRG-2 SoC simplifies new designs with its programmable processor, peripheral set and battery-friendly design. It is Bluetooth 5.0-certified, which ensures interoperability with the latest generation of smartphones, and supports state-of-the-art security, privacy, and extended packet length for faster data transfer. A comprehensive SDK and an amazingly friendly navigator GUI are available to ease its adoption.


STM32 Nucleo expansion board for NFC Forum Type 5 dynamic tag solutions

The X-NUCLEO-NFC04A1 helps developers easily embed in their designs a dual-interface ST25DV Tag IC with both NFC/RFID contactless interface and a wired I2C connection. Offering a 4-Kbit EEPROM, a Fast Transfer mode with a 256-byte buffer, as well as energy-harvesting capabilities, it is suited for both IoT and Industrial applications, by enabling zero-power applications, convenient contactless data-log diagnostics and in-application programming at the point of use.


STM32Cube low-layer APIs now deployed across all STM32 series

STM32Cube low-layer (LL) APIs, a light-weight, optimized, expert-oriented set of APIs designed for both performance and runtime efficiency, are now fully deployed across all existing STM32 series. Usable in standalone or in parallel with STM32Cube HALs (with a few restrictions), they also offer an easy migration path from the STM32 standard peripheral libraries, and it has never been easier to migrate old SPL projects into the Cube environment.

Our step-by-step video shows how to easily port them from one STM32 board to another.


Enhanced balun with integrated harmonic filter for BlueNRG transceivers

The BALF-NRG-02D3 ultraminiature balun integrates both matching network and harmonics filter. Matching impedance is customized for both the BlueNRG-1 and the new-generation BlueNRG-2 Bluetooth® Low Energy (BLE) systems-on-chip. As a single-component solution, it simplifies RF complexity, provides optimized link budget in a footprint less than 1.2 mm². Its non-conductive glass substrate offers low dispersion over temperature, surpassing current solutions.


Ease your transition to surface-mount Triacs with ST’s extended D²PAK portfolio

ST further extends its D²PAK offer for Triacs, ideal for compact designs. With parts ranging from 8 to 30 A, this Triac D²PAK offer is particularly suited for home and factory automation, allowing innovative designs with isolated metal substrate (IMS) and direct-bonded copper boards.


Dot-sized ESD-clamping diodes guards smart objects from failures

ST’s new 0.6 x 0.3-mm single-line ESD-protection diodes quickly clamp transients to a low voltage thanks to their snap-back technology with 5.8 V trigger voltage. With a respective capacitance of 7.5 pF and 6 pF, both the unidirectional ESDZL5-1F4 and the bidirectional ESDZV5-1BF4 ensure high-speed signal application compatibility for space-constrained smart objects.


Get the right TVS for your application with a touch on your screen

Our new Protect-Finder mobile app allows you to explore our comprehensive portfolio of certified protection ICs anytime, anywhere from your smartphone… Available for Android™ and iOS™,


STNRGPF01: The PFC digital controller with a touch of analog and a GUI

This post looks at the techniques used in power factor correction and how the combination of the STNRGPF01 silicon and the eDesignSuite, to generate the digital configuration code, make implementation easy.